NCP1650
PACKAGE DIMENSIONS
16
1
--A--
9
8
--B--
P
8 PL
SOIC--16
CASE 751B--05
ISSUE K
0.25 (0.010) M B S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
MILLIMETERS
INCHES
--T--
SEATING
PLANE
G
K
C
M
R
X 45 _
J
F
DIM
A
B
C
D
F
G
J
K
M
P
R
MIN MAX
9.80 10.00
3.80 4.00
1.35 1.75
0.35 0.49
0.40 1.25
1.27 BSC
0.19 0.25
0.10 0.25
0 _ 7 _
5.80 6.20
0.25 0.50
MIN MAX
0.386 0.393
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
0 _ 7 _
0.229 0.244
0.010 0.019
D
16 PL
0.25 (0.010)
M
T B
S
A
S
SOLDERING FOOTPRINT*
8X
6.40
1
16X
1.12
16
16X
0.58
1.27
PITCH
8
9
DIMENSIONS: MILLIMETERS
*For additional information on our Pb--Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer ’s technical experts. SCILLC does not convey any license under its patent rights
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NCP1650/D
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